Basics:
The chip mounter FCM 4080 is a highly flexible machine for design laboratories and small to medium lot size production. The FCM 4080 has the capability for a high range of pick and place applications such as die bonding, Flip Chip processing, SMD placement, die sorting, stamping or dispensing of epoxy and solder paste as well as applying solder preform.
Upgrade:
The FCM 4080 can be easily upgraded from a semi-automatic machine to a fully automatic diebonder with automatic alignment via vision system .
The machine can be adapted to individual requirements through step by step upgrades with minimal effort.
This high flexibility provides the chance to start production with minimal investment and let the equipment grow with increasing production or new applications.
User friendly, menu driven programming, quick tool change and simple product change over help to minimize production cost.
Design:
- AL Frame with solid base plate
- One x/y-table each for die-pick-up and die-attach
- Driving range of the table is 8"
The chip-pickup table can be equipped with a variety of holders for film frames, wafer rings, waffle trays and gel packs.
The substrate table has a flat surface with several threads in order to accommodate standard workholders or customer specific workholders.
Die eject unit in order to lift the chips from film (optional). The die ejector is available with single or multiple needle ejector heads.
Pick & Place- head with x-z motion. After aligning the die-pickup -and attach position the chip will be fully automatically picked up and positioned on the substrate.
Dispense arm for glue application. It applies the media (glue, solder paste or preform) simultaneuosly while the first arm picks up the die. This simultaneous process reduces the process time. The dispense arm can optionally be equipped with a dispense head, a stamp/print tool or a pickup tool.
The tool holders are spring-loaded. The bond force is adjustable.
DC-motor driven rotating epoxy-pot (optional) with adjustable RPM and squeegee for glue application in the stamping mode.
Two vertically fix mounted cameras. The cameras are positioned above the pick-up and attach position. In the semiautomatic version the alignment is done via monitor and programmable frame on the screen, in the fully automatic version via vision system.
Flip Chip system on wafer table (optional).
Additional camera (optional) for precise position detection or for automatically optical chip underside inspection.
Operating via TFT Touchscreen.
